Method and system of advanced fan speed control

ABSTRACT

According to some embodiments, a method, system, and apparatus to provide thermal management control. In some embodiments, the method includes receiving, by a control mechanism, a plurality of temperature representative signals from a plurality of temperature sensors, receiving a command signal from the control mechanism by an output weighting matrix mechanism, and controlling at least one thermal cooling device with at least one weighted output signal from the output weighting matrix mechanism.

BACKGROUND

Electrical devices that include a number of electrical components (e.g.,a power supply, a memory/storage device, a processor, etc.) continue toincrease in complexity. Electrical components dissipate unusedelectrical energy as thermal energy that may reduce the reliability ofthe electrical components. The reliability of the electrical componentsand the electrical device may improve by managing the thermal energycreated by the electrical components.

Thermal cooling devices such as fans may be used to cool an electricaldevice and the electrical components thereof. However, thermalmanagement of the electrical device and the electrical components may belimited without an efficient thermal management controller.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is an exemplary flow diagram of a method, according to someembodiments hereof;

FIG. 2 illustrates an exemplary block diagram of an apparatus, accordingto some embodiments hereof;

FIG. 3 is another exemplary block diagram, in accordance with someembodiments hereof;

FIG. 4 is an exemplary illustration of an output weighting matrix,according to some embodiments hereof; and

FIG. 5 is an exemplary block diagram of a system in accordance with someembodiments herein.

DETAILED DESCRIPTION

The several embodiments described herein are solely for the purpose ofillustration. Embodiments may include any currently or hereafter-knownversions of elements and aspects of the various embodiments describedherein. Therefore, persons skilled in the art will recognize from thisdescription that other embodiments may be practiced with variousmodifications and alterations.

FIG. 1 is provides an exemplary flow diagram of a process 100, used insome embodiments herein, to provide a thermal management process. Atoperation 105, a temperature representative signal is received by acontroller. In some embodiments, the temperature representative signalis representative of a measured temperature in a vicinity of atemperature sensor. A thermal cooling device may be located in avicinity of the temperature sensor. The thermal cooling device mayinclude a fan or other device suitable for dissipating thermal energygenerated by an electrical component or device.

The received temperature representative signal may be provided by anynumber of different temperature measurement devices and techniques. Forexample, a thermal diode, a thermistor, and other temperature detectiondevices and sensors may be used to measure a temperature at variouslocations of an electronic device or component. For example, one or morelocations such as a printed circuit board, a CPU or other integratedcircuit, and/or ambient air within a chassis of an electronic devicehousing may be monitored for a temperature measurement.

In some embodiments, the temperature at a number of locations may bemonitored, and a plurality of temperature representative signals may beprovided. The plurality of temperature representative signals mayinclude one temperature representative signal for each of the pluralityof monitored temperatures. It should be appreciated that the particularnumber of temperatures monitored and the method or technique used fordetermining or acquiring the temperature representative signalsindicative of the measured temperatures may vary.

The controller of operation 105 provides a mechanism, in response to atemperature representative signal, to control an operation of a thermalcooling device. The controller may provide a signal to control anoperating parameter of the thermal cooling device. One such operatingparameter that may be controlled by a signal from the controller may be,for example, a variable speed of a cooling fan.

In some embodiments, the controller of operation 105 may be aproportional controller. A proportional controller may provide anoutput, command, or signal that is proportional to an input, signal,command, measurement, or determination (e.g., a temperature differencebetween a set point temperature and a sensed temperature). In someembodiments, instead of a proportional only controller, the controllermay be a proportional integral derivative (PID) controller. It will beappreciated that a PID controller offers control and response advantagesas compared to a proportional only controller. The PID controller may beresponsive to an error or change in the temperature representativesignal (i.e., proportional), an amount of time the error is present(i.e., integral), and a rate of change of the measured temperature orerror therein (i.e., derivative). The operation of a PID controller willbe appreciated and understood by those in the art, thus a detaileddiscussion thereof is not provided in the present disclosure.

At operation 110, a command signal from the control mechanism (e.g., PIDcontroller) is provided to an output weighting matrix. In someembodiments, the command signal from the control mechanism is based, atleast in part, on the temperature representative signal. In someembodiments, the command signal from the control mechanism may beconditioned to be received by the output weighting matrix.

At 115, at least one weighted output signal from the output weightingmatrix is provided to control at least one thermal cooling device. Theoutput weighting matrix assigns a weight to a signal output therefrom.The weight assigned to the output signals of the output weighting matrixmay vary an aspect of the output signal. For example, the assignedweight may operate to vary an amplitude, duration, timing, etc. of theoutput signal. In some embodiments, the weight assigned to an outputsignal from the output weighting matrix may be based on, for example, anapplication of the output signal, a control scheme, or otherconsideration. That is, different applications, control schemes, andother factors may be a determining criteria in the weight accorded tothe output signal.

For example, depending on an application or perhaps interface connectedto an output signal of the output weighting matrix, the output signalmay have a weight of 1.0 (i.e., 100% of the output signal), 0.75 (i.e.,75% of the output signal), or any of a number of weights. In someembodiments, a thermal management scheme or criteria may be onedeterminant regarding the weight assigned to an output signal. Forexample, a maximum or desired temperature limit for a particularcomponent or an electrical device, a maximum or desired temperaturelimit for a the electrical device, a sustained or prolonged temperaturelimit for an electrical component or device, a maximum or desiredacoustic level for an electrical component or device, etc. may beconsiderations regarding the weight assigned to an output signal.

It should be appreciated that the value, range, and/or number of weightsthat may be assigned to an output signal from the output weightingmatrix may vary. In some embodiments, the value, range, and/or number ofweights assigned to an output signal may be based on, for example, athermal management objective (e.g., temperature thresholds and limits),and other criteria such as, but not limited to, acoustic managementobjectives, reliability objectives, power limitations, etc.

In some embodiments, the various values (i.e., weight) assigned to anoutput signal from the output weighting matrix may be static (i.e.,fixed). The static values may be predetermined and based on a number offactors. Factors may include, for example, an application, an operatingefficiency, component operational specifications, etc. In someembodiments, the various values (i.e., weight) assigned to an outputsignal from the output weighting matrix may be dynamically determinedand/or assigned. That is, the weight value assigned to an output signalfrom the output weighting matrix may vary, as opposed to being set orfixed at one value. For example, the weighted value(s) assigned to anoutput signal may vary based on a relationship such as, for example, anequation, an algorithm, a measured, determined, or calculated value,etc.

In some embodiments, the various values assigned to an output signalfrom the output weighting matrix may be a combination of static anddynamic values.

FIG. 2 provides an exemplary block diagram of a system 200 in accordancewith some embodiments herein. System 200 includes a thermal managementcontroller 205 that provides thermal management control for a number ofthermal cooling devices in response to a number of inputs thereto.Thermal management controller 205 includes a proportional controller 210and an output weighting matrix 215. Proportional controller 210 andoutput weighting matrix 215 may operate in accordance with a thermalmanagement process such as, for example, the thermal management process100 shown in FIG. 1.

Thermal management controller 205 may receive a number of temperaturerepresentative signals 260 as inputs thereto. Thermal managementcontroller 205 may receive a temperature representative signal from anumber of temperature sensors 220, 225, and 230 that measuretemperatures T1, T2, and Tx, respectively. It should be appreciated thatthe number of temperature representative signals 260 received by thermalmanagement controller 205 may vary. Temperature sensors 220, 225, and230 shown in FIG. 2 are provided to depict a concise and illustrativeexample of the temperature representative signals that may be providedto proportional controller 210 herein that is neither exhaustive norlimiting.

Thermal management controller 205 may provide a number of weightedoutput signals 255 as outputs therefrom. Weighted output signals 255 maybe provided to control, at least in part, an operational parameter ofthermal cooling devices 235, 240, 245, and 250. The thermal coolingdevices may include, for example, CPU fan 235, chassis fan 240, powersupply fan 245, and fan 250. The thermal cooling devices may be locatedat a variety of locations to provide thermal cooling to a variety ofdevice locations. For example, fan 1 (235) may be located in thevicinity of a CPU to cool the CPU, fan 2 (240) may be located within achassis of an electrical device to cool the ambient air therein, and fan3 (245) may be located in the vicinity or on a power supply to cool thepower supply.

Weighted output signals 255 may be provided to control, at least inpart, an operational speed of fans 235, 240, 245, and 250. Efficientcontrol of thermal cooling devices 235, 240, 245, and 250 may impact areliability and/or acoustic performance of an electronic device and/orcomponent that is cooled using thermal management device 205.

It should be appreciated that the number of weighted output signals 255provided by thermal management controller 205 may vary. Thermal coolingdevices 235, 240, 245, and 250 shown in FIG. 2 are provided to depict aconcise and illustrative embodiment herein that is neither exhaustivenor limiting.

Referring to FIG. 3, there is shown an exemplary block diagram of asystem 300 in accordance with some embodiments herein. System 300 uses apulse width modulation (PWM) control scheme to control a number ofcooling fans. FIG. 3 includes a number of PID control mechanisms 314,326, and 334. It should be appreciated that the number and type ofcontrollers provided in system 300 may vary. The PID controllersgenerally have as inputs thereto a temperature representative signal anda temperature limit signal.

In some embodiments, system 300 provides thermal management for anelectronic device having a CPU. A temperature, T1, in the vicinity ofthe CPU is measured by a sensor 310 including, for example, a thermalmonitoring diode. A temperature, T3, in the vicinity of a fan alsolocated near the CPU is measured by a sensor 302 including, for example,a thermistor. The thermistor may measure exhaust ambient air that passesthrough the fan.

A temperature representative signal from sensor 302 is subject to anambient gain formula at 304 and is passed to a PWM amplifier 306 thatgenerates a PWM gain (Tamb) signal. A temperature representative signalfrom sensor 310 is provided to PID control mechanism 314. PID controlmechanism 314 receives a T1 temperature limit signal 312 that limits aresponse to temperature T1 provided by PID control mechanism 314. Avalue of the T1 temperature limit signal may be a function of the CPUmonitored by temperature T1. PID control mechanism 314 provides a signalto device 316 that generates a signal regarding an amount of change fora pulse width modulation signal (ΔPWM). The PWM gain (Tamb) signal andΔPWM signal are received and subject to a gained PWM algorithm at 308that generates a signal regarding a PWM amount of change command signal(ΔPWM_T1 Gained) at 320. Thus, it is seen that system 300 provides aproportional controller with an ambient feedback gain control for a CPUtemperature control loop.

PID control mechanism 326 receives a temperature representative signalfrom a temperature T2 sensor or monitor 324. PID control mechanism 314also receives a T2 temperature limit signal 322 that limits a responseto temperature T2 provided by PID control mechanism 326. PID controlmechanism 326 provides a signal to device 328 that generates a signalregarding an amount of change for a pulse width modulation controlsignal for T2 (ΔPWM_T2). Output weighting matrix 338 receives a commandsignal for adjusting the PWM control signal for a cooling deviceassociated with the location of the measured temperature T2 (e.g.,chassis ambient air).

In a manner similar to that described for PID control mechanism 326 andtemperature representative signal T2, PID control mechanism 334 receivesa temperature representative signal Tx from a temperature sensor ormonitor 332 and a Tx temperature limit signal 332. PID control mechanism334 provides a signal to device 336 that generates a signal regarding anamount of change for a pulse width modulation control signal for T2(ΔPWM_T2). Output weighting matrix 338 receives a command signal foradjusting the PWM control signal for a cooling device associated withthe location of the measured T2 (e.g., a power supply).

Output weighting matrix 338 may provide a number of weighted outputsignals 376 to control a number of thermal cooling devices such as, forexample, fans 366, 370, and 374. The weights assigned to the outputsignals of output weighting matrix 338 may be based on predetermined,selectable, static, or dynamic values. The weight assignment values maybe based on control scheme algorithms, desired reliability criteria,desired acoustic criteria, and other considerations that may be relatedto design and/or performance considerations.

The thermal cooling devices may be located at a variety of locations toprovide thermal cooling to a variety of device locations. For example,fan 1 (366) may be located in the vicinity of a CPU, fan 2 (370) may belocated within a chassis to cool the ambient air therein, and fan 3(374) may be located in the vicinity or on a power supply to cool thepower supply. It should be appreciated that other locations may bemonitored for temperature and that other types of cooling devices may beused in system 300, other than those shown in FIG. 3.

FIG. 3 shows an output weighting matrix 338 implemented using a numberof devices 340-362 for assigning weights to output signals 376. Itshould be appreciated that the number of devices for assigning weightsto output signals 376 may vary from one device to a plurality of suchdevices. It should also be appreciated that the particular basis fordetermining or assigning weights to output signals 376 may also varyform that depicted in FIG. 3. For example, FIG. 3 shows a formula ineach of the weight assigning devices 340-362 that generally states thatthe assigned weight is equal to the PWM signal input thereto multipliedby the weight associated with the particular weight assigning device340-362. Again, the particular basis for determining or assigningweights to output signals 376 may vary.

Weighted output signals 376 may be provided to a PWM comparatormechanism prior to being received at thermal cooling devices 366, 370,and 374. For example, the weighted output signals associated withcontrolling thermal cooling device 366 are first received by PWMcomparator mechanism 364, the weighted output signals associated withcontrolling thermal cooling device 370 are received by PWM comparatormechanism 368, and the weighted output signals associated withcontrolling thermal cooling device 374 are received by PWM comparatormechanism 372. The PWM comparator mechanisms may compare the weightedoutput signals 376 received thereby and pass the weighted outputsignal(s) having the greatest value on to the thermal cooling deviceassociated therewith.

The PWM comparator mechanisms may pass the weighted output signal havingthe greatest value to the thermal cooling device associated with the PWMcomparator mechanism such that the thermal cooling system 300 providesat least a minimum cooling in accordance with the weighting schemeprescribed by output weighting matrix 338.

Weighted output signals 376 may be provided to control an operationalspeed of fan 1, fan 2, and fan 3. Efficient control of thermal coolingdevices 366, 370, and 374 may effect the reliability and/or acousticperformance of an electronic device and/or component that is cooled bysystem 300.

Output weighting matrix 338 may provide a mechanism for controlling aplurality of thermal cooling devices (e.g., fans 366, 370, and 370) thatis based on one temperature representative signal (e.g., T1). This isillustrated in FIG. 3 wherein output weighting devices 340, 342, and 344provide output signals to PWM comparator mechanisms 364, 368, and 372 tocontrol fan 1, fan 2, and fan 3, respectively. That is multiple thermalcooling devices (366,370, and 374) are controlled based on a temperaturerepresentative signal from one temperature sensor (T1/T3).

Output weighting matrix 338 may provide a mechanism for controlling onethermal cooling device (e.g., fan 366) based on a plurality oftemperature representative signals (e.g., T1, T2, and Tx). This isillustrated in FIG. 3 by the signals from output weighting devices 340,346, and 352 that provide output signals to PWM comparator mechanism 364to control fan 1 (366). That is one thermal cooling device (366) iscontrolled based on multiple temperature sensors (T1/T3, T2, and Tx).

It should be appreciated that based on the weights assigned to theoutput signal(s) of output weighting matrix 338, the number oftemperature representative signals and the number of thermal coolingdevices controlled thereby may vary.

FIG. 4 is an exemplary block diagram of an output weighting matrix 400in accordance with some embodiments herein. Output weighting matrix 400provides an illustrative conceptual representation of weights assignedto control signals associated with a number of temperaturerepresentative signals T1, T2, and Tx (405) for controlling a number ofthermal cooling devices fans F1, F2, and Fx (410). For example, forcontrolling fan 1 (F1) the temperature representative signal controlsignal T1 is assigned a weight of 1.0, for controlling fan 2 (F2) thetemperature representative signal control signal T2 is assigned a weightof 0.5, and for controlling fan 3 (F3) the temperature representativesignal control signal Tx is assigned a weight of 0. The assigned weightmay correlate to a percentage of the amplitude value of the signal thatis output by output weighting matrix 338. Thus, a weight of 1.0 maycorrelate to a 100% output of the control signal (e.g., T1), a weight of0.5 correlates to a 50% output of the control signal (e.g., T2), and aweight of 0 correlates to a 0% output of the control signal (e.g., T2).It should be appreciated that the weight assignments illustrated in FIG.4 are merely illustrative of but one example herein. In someembodiments, output weighting matrix 400 may be implemented in a look-uptable stored in a memory.

FIG. 5 is an exemplary block diagram of a system 500 in accordance withsome embodiments herein. System 500 may include, for example, atemperature sensor 505 in a vicinity of a chassis fan 510 within achassis of an electronic device; a temperature sensor 525 and a fan 515in a vicinity of a power supply 520; a thermal diode 540, a CPU fan 530,and a thermistor 535 in a vicinity of a CPU 545; and a thermalmanagement controller 550. Thermal management controller 550 may includea number of controllers and an output weighting matrix in accordancewith some embodiments herein, such as system 200 and 300. Thecontrollers comprising thermal management controller 550 may include aproportional controller, a PID controller, other types of controlmechanisms, and combinations thereof. In some embodiments, fewer or morecomponents than are shown in FIG. 5 may be included in system 500.

Processor 545 may be or include any number of processors, which may beany type or configuration of processor, microprocessor, and/ormicro-engine that is or becomes known or available. In some embodiments,other electronic and/or electrical devices may be utilized in place ofor in addition to processor 545. Processor 545 may, for example, be orinclude any device, object, and/or component that generates, stores,and/or requires removal of heat. According to some embodiments,processor 545 may be an XScale® Processor such as an Intel® PXA270XScale® processor. Memory 555 may be or include, according to someembodiments, one or more magnetic storage devices, such as hard disks,one or more optical storage devices, and/or solid state storage. Memory555 may store, for example, applications, programs, procedures, and/ormodules that store instructions to be executed by processor 545. Memory555 may comprise, according to some embodiments, any type of memory forstoring data, such as a Single Data Rate Random Access Memory (SDR-RAM),a Double Data Rate Random Access Memory (DDR-RAM), or a ProgrammableRead Only Memory (PROM).

In some embodiments, chassis fan 510, power supply fan 515, and CPU fan530 may coupled to thermal management controller 550. Chassis fan 510,power supply fan 515, and CPU fan 530 may, for example, remove and/ordissipate thermal energy in an interior space of a device chassis, in avicinity of power supply 520, and in a vicinity of CPU 545 vicinity of athe processor 545, respectively by blowing air (e.g., represented bydashed arrows lines in FIG. 5).

Thermal management controller 550 may provide weighted output signals tocontrol operational speeds of chassis fan 510, power supply fan 515, andCPU fan 530. The operational speed of fans 510, 515, and 530 maycorrespond to a cooling capacity of the fans. The operational speed offans 510, 515, and 530 may have an impact on, for example, a reliabilityand/or acoustic performance of system 500.

Thermal management controller 550 may include an output weightingmatrix. The output weighting matrix of system 500 may be similar to theoutput weighting matrix shown in FIGS. 2 and 3. In some embodiments,thermal management controller 550 provides a mechanism for controllingfans 510, 515, and 530 based on temperature representative signalsreceived from temperature sensors 505, 525, 540, and 535.

In some embodiments, more than one of the multiple thermal coolingdevices (i.e., fans 1, 2, and 3) may be controlled based on one of thetemperature representative signals from one of temperature sensors 505,525, and 535 and 540. In some embodiments, the one of the multiplethermal cooling devices (i.e., fans 1, 2, and 3) may be controlled basedon a plurality of the temperature representative signals fromtemperature sensors 505, 525, and 535 and 540.

In some embodiments, thermal management controller 550 may provide acontrol mechanism or scheme for responding to temperature representativesignals that may be varied based on, for example, a desired temperatureresponse, a desired fan acoustic level output, or other considerations.For example, by assigning various weights to the controlling outputsignals from thermal management controller 550, a number of fans can becontrolled to be responsive to, for example, a request to cool a CPU.That is, CPU fan 530 and chassis fan 510 may be responsive to providecooling (i.e., increase speed of fans 530 and 510) cool processor 545.The combination of fans 530 and 510 may operate quieter or moreefficiently than CPU fan 530 alone in cooling processor 545 in thedesired manner.

In some embodiments, the mechanism for assigning weights to outputsignals of thermal management controller 550 (e.g., an output weightingmatrix) may be predetermined and fixed. In some embodiments, themechanism for assigning weights to output signals of thermal managementcontroller 550 (e.g., an output weighting matrix) may be dynamic,capable of “self-optimizing”. That is, the weights assigned the variousout of thermal management controller 550 may have a starting value(e.g., default value) but the weights may change or be updated dependingon observed system characteristics (e.g., received temperaturerepresentative signals). In some embodiments, the dynamic weight valuesmay be used to update an output weighting matrix such as the tabledepicted in FIG. 4.

In some embodiments, the mechanism for assigning weights to outputsignals of thermal management controller 550 (e.g., an output weightingmatrix) may be programmable or otherwise selectively changed. Thechanges may be implemented via a user input provide by a user interface.

In some embodiments, thermal management device 550 may be implementedin, for example, an integrated circuit, either as a discrete chip ortogether with other functional circuitry. In some embodiments, thermalmanagement device 550 may be implemented as part of an interfacecontroller hub (e.g., a chipset) that includes, for example, a systemcontroller, peripheral controllers, and a memory controller.

The several embodiments described herein are solely for the purpose ofillustration. Persons in the relevant art will recognize from thisdescription other embodiments may be practiced with modifications andalterations, limited only by the claims.

1. An apparatus comprising: a control mechanism to receive at least onetemperature representative signal and to output a command signal based,at least in part, on the temperature representative signal; and anoutput weighting matrix mechanism to receive the command signal from thecontrol mechanism and, in response thereto, output at least one weightedoutput signal to control multiple thermal cooling devices based on onetemperature representative signal of the at least one temperaturerepresentative signal or to control a single thermal cooling devicebased on multiple temperature representative signals of the at least onetemperature representative signal.
 2. The apparatus of claim 1, whereinthe control mechanism comprises a proportional controller.
 3. Theapparatus of claim 1, wherein at least one of the plurality oftemperature representative signals is received from an ambienttemperature sense circuitry including feedback gain control.
 4. Theapparatus of claim 1, wherein the control mechanism receives at leastone temperature limit signal associated with at least one of theplurality of the temperature representative signals.
 5. The apparatus ofclaim 4, wherein the at least one of the plurality of temperaturerepresentative signals associated with the temperature limit signal isreceived from an ambient temperature sense circuitry including feedbackgain control.
 6. The apparatus of claim 4, wherein each of the pluralityof the temperature representative signals is associated with one of theat least one temperature limit signals.
 7. The apparatus of claim 4,wherein the temperature limit signal limits a response of the controlmechanism.
 8. The apparatus of claim 1, wherein the control mechanismcomprises a proportional, integral, and derivative (PID) controller. 9.The apparatus of claim 1, wherein a weight value associated with the atleast one weighted output signal is static.
 10. The apparatus of claim1, wherein a weight value associated with the at least one weightedoutput signal is dynamic.
 11. A method comprising: receiving, by acontrol mechanism, at least one temperature representative signal fromat least one temperature sensor; providing a command signal from thecontrol mechanism to an output weighting matrix mechanism; providing, inresponse to the command signal, at least one weighted output signal fromthe output weighting matrix mechanism to control multiple thermalcooling devices based on one temperature representative signal of the atleast one temperature representative signal or to control a singlethermal cooling device based on multiple temperature representativesignals of the at least one temperature representative signal; andcontrolling, based on the provided at least one weighted output signalfrom the output weighting matrix mechanism, the multiple thermal coolingdevices based on the one temperature representative signal of the atleast one temperature representative signal or the single thermalcooling device based on the multiple temperature representative signalsof the at least one temperature representative signal.
 12. The method ofclaim 11, wherein at least one of the at least one temperaturerepresentative signal is received from an ambient temperature sensecircuitry including feedback gain control.
 13. The method of claim 11,wherein the control mechanism receives at least one temperature limitsignal associated with at least one of the plurality of the temperaturerepresentative signals.
 14. The method of claim 13, wherein the at leastone of the at least one temperature representative signal associatedwith the temperature limit signal is received from an ambienttemperature sense circuitry including feedback gain control.
 15. Themethod of claim 13, wherein each of the at least one temperaturerepresentative signal is associated with one of the at least onetemperature limit signals.
 16. The method of claim 13, wherein thetemperature limit signal limits a response of the control mechanism. 17.The method of claim 11, wherein the control mechanism comprises aproportional controller.
 18. The method of claim 11, wherein the controlmechanism comprises a proportional, integral, and derivative (PID)controller.
 19. The method of claim 11, wherein the thermal coolingdevice is a fan.
 20. The method of claim 11, further comprisingcontrolling a plurality of the at least one thermal cooling device basedon one of the plurality of temperature representative signals.
 21. Themethod of claim 11, further comprising controlling one of the at leastone thermal cooling device based on more than one of the plurality oftemperature representative signals.
 22. The method of claim 11, furthercomprising associating a weight value with the at least one weightedoutput signal.
 23. The method of claim 22, wherein the weight valueassociated with the at least one weighted output signal is static. 24.The method of claim 22, wherein the weight value associated with the atleast one weighted output signal is dynamic.
 25. A system comprising: acontrol mechanism to receive at least one temperature representativesignal and to output a command signal; an output weighting matrixmechanism to receive the command signal from the control mechanism and,in response thereto, output at least one weighted output signal tocontrol multiple thermal cooling devices based on one temperaturerepresentative signal of the at least one temperature representativesignal or to control a single thermal cooling device based on multipletemperature representative signals of the at least one temperaturerepresentative signal; at least one thermal cooling device controlled,at least in part, by the at least one weighted output signal; aprocessor cooled by, at least, the thermal cooling device; and a doubledata rate memory connected to the processor.
 26. The system of claim 25,wherein the control mechanism to receive a plurality of temperaturerepresentative signals is a proportional, integral, and derivative (PID)controller.
 27. The system of claim 25, wherein a weight value isassociated with the at least one weighted output signal and the weightvalue is dynamic.